Product Development Engineer in FCBGA (Foreign Engineers)
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- 모집기간 : 채용시까지
◈ 직무 개요
- Implement new process development and optimized process architecture to develop Package FCBGA Substrate (Large Body & Multi Layer) with ultimate operational capability
- Lead optimized path introduction for high performance Server/AI product and HVM (High Volume Manufacturing) stabilization in Busan and SEMV (Samsung Electro-Mechanics Vietnam) factories - Ensure effective management and execution of improvement activities and advanced technology development for yield stabilization
◈ 경력 요건
- 10-20 years’ experience in FCBGA Substrates related
- Bachelor’s degree in Engineering and Science (Electrical, Electronics, Metallurgical, Material, Chemical. Mechanical, - Fluent in English
- Experience in High-Performance Package Substrate Development for Server/AI Application (Establishing automated substrate production lines and improving yield through Line Optimization)
- Experience in Symmetric/Asymmetric Embedding and MLC Process Development (Developing MLC/Embedding structures and analyzing PI characteristics. Thick core embedding development)
- Experience in Process Optimization and New Technology/Product Development (Developing and utilizing impedance prediction models and matching process. Low-roughness etching processes and low dry film material development)
- Experience in High-Performance Package Substrate Development for Server/AI Application (Establishing automated substrate production lines and improving yield through Line Optimization)
- Experience in Symmetric/Asymmetric Embedding and MLC Process Development (Developing MLC/Embedding structures and analyzing PI characteristics. Thick core embedding development)
- Experience in Process Optimization and New Technology/Product Development (Developing and utilizing impedance prediction models and matching process. Low-roughness etching processes and low dry film material development)
◈ 제출 서류 및 기타
- 영문 이력서
◈ 담당 컨설턴트
- 김종수 / 02-2016-6634 / [email protected]
14시간 전(updated. 14시간 전)